5,922 research outputs found

    Fracture strain of LPCVD polysilicon

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    A polysilicon bridge-slider structure in which one end of the bridge is fixed and the other is connected to a plate sliding in two flanged guideways, is designed and fabricated to study the strain at fracture of LPCVD polysilicon. In the experiments, a mechanical probe is used to push against the plate end, compressing and forcing the bridge to buckle until it breaks. The distance that the plate needs to be pushed to break the bridge is recorded. Nonlinear beam theory is then used to interpret the results of these axially-loaded-bridge experiments. The measured average fracture strain of as-deposited LPCVD polysilicon is 1.72%. High-temperature annealing of the bridge-sliders at 1000°C for 1 h decreases the average fracture strain to 0.93%

    Implantable RF-coiled chip packaging

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    In this paper, we present an embedded chip integration technology that utilizes silicon housings and flexible parylene radio frequency (RF) coils. As a demonstration of this technology, a flexible parylene RF coil has been integrated with an RF identification (RFID) chip. The coil has an inductance of 16 μH, with two layers of metal completely encapsulated in parylene-C. The functionality of the embedded chip is verified using an RFID reader module. Accelerated-lifetime soak testing has been performed in saline, and the results show that the silicon chip is well protected and the lifetime of our parylene-encapsulated RF coil at 37 °C is more than 20 years

    MEMS flow sensors for nano-fluidic applications

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    This paper presents micromachined thermal sensors for measuring liquid flow rates in the nanoliter-per-minute range. The sensors use a boron-doped polysilicon thinfilm heater that is embedded in the silicon nitride wall of a microchannel. The boron doping is chosen to increase the heater’s temperature coefficient of resistance within tolerable noise limits, and the microchannel is suspended from the substrate to improve thermal isolation. The sensors have demonstrated a flow rate resolution below 10 nL/min, as well as the capability for detecting micro bubbles in the liquid. Heat transfer simulation has also been performed to explain the sensor operation and yielded good agreement with experimental data

    A suspended microchannel with integrated temperature sensors for high-pressure flow studies

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    A freestanding microchannel, with integrated temperature sensors, has been developed for high-pressure flow studies. These microchannels are approximately 20ÎĽm x 2ÎĽm x 4400ÎĽm, and are suspended above 80 ÎĽm deep cavities, bulk micromachined using BrF3 dry etch. The calibration of the lightly boron-doped thermistor-type sensors shows that the resistance sensitivity of these integrated sensors is parabolic with respect to temperature and linear with respect to pressure. Volumetric flow rates of N2 in the microchannel were measured at inlet pressures up to 578 psig. The discrepancy between the data and theory results from the flow acceleration in a channel, the non-parabolic velocity profile, and the bulging of the channel. Bulging effects were evaluated by using incompressible water flow measurements, which also measures 1.045x10^-3N-s/m^2 for the viscosity of DI water. The temperature data from sensors on the channel shows the heating of the channel due to the friction generated by the high-pressure flow inside

    A MEMS electrostatic particle transportation system

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    We demonstrate here an electrostatic MEMS system capable of transporting particles 5-10ÎĽm in diameter in air. This system consists of 3-phase electrode arrays covered by insulators (Figs. 1, 2). Extensive testing of this system has been done using a variety of insulation materials (silicon nitride, photoresist, and Teflon), thickness (0- 12ÎĽm), particle sizes (1-10ÎĽm), particle materials (metal, glass, polystyrene, spores, etc), waveforms, frequencies, and voltages. Although previous literature [1-2] claimed it impractical to electrostatically transport particles with sizes 5-10ÎĽm due to complex surface forces, this effort actually shows it feasible (as high as 90% efficiency) with the optimal combination of insulation thickness, electrode geometry, and insulation material. Moreover, we suggest a qualitative theory for our particle transportation system which is consistent with our data and finite-element electrostatic simulations

    A micro cell lysis device

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    A new micromachined cell lysis device is developed. It is designed for miniature bio-analysis systems where cell lysing is needed to obtain intracellular materials for further analysis such as DNA identification. It consists of muti-electrode pairs to apply electric fields to cells. We adopt the means of using electric field lysing because it can greatly simplify purification steps for preparation of biological samples, when compared to conventional chemical methods. Yeast, Chinese cabbage, radish cells and E. coli are tested with the device. The lysis of yeast, Chinese cabbage, radish cells is observed by a microscope. The experimental observation suggests E. coli are also lysed by the pulsed electric field. The range of electric field for the lysis is on the order of 1 kV/cm to 10 kV/cm. In addition, for practical reasons, we reduce the voltage required for lysing to less than 10 V by making the electrode gap on the order of microns

    Micro heat exchanger by using MEMS impinging jets

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    A micro impinging-jet heat exchanger is presented here. Heat transfer is studied for single jet, slot arrays and jet arrays. In order to facilitate micro heat transfer measurements with these devices, a MEMS sensor chip, which has an 8 x 8 temperature-sensor array on one side, and an integrated heater on the other side has been designed and fabricated. This sensor chip allows 2-D surface temperature measurement with various jets impinging on it. It is found that micro impinging jets can be highly efficient when compared to existing macro impinging-jet microelectronics packages such as IBM 4381. For example, using a single nozzle jet (500-μm diameter driven by 5 psig pressure), the sensor chip (2 x 2 cm^2) temperature can be cooled down from 70 to 33°C. The cooling becomes more efficient when nozzle arrays (4x5 over 1 cm^2 area) are used under the same driving pressure. Interestingly, although higher driving pressure gives better cooling (lower surface temperature), the cooling efficiency, defined as h/0.5pv^2, is actually higher for lower driving pressure

    Corrosion Behavior of Parylene-Metal-Parylene Thin Films in Saline

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    In this paper, we study the corrosion behavior of parylene-metal-parylene thin films using accelerated-lifetime soak tests. The samples under test are thin film resistors with a 200 nm layer of Au sandwiched by parylene-C on both sides, fabricated with parylene-metal skin technology. The samples are tested in hot saline both passively and actively, and different failure modes are observed using optical and electron-beam metrologies. Bubbles and delamination are first seen in the samples after 2 days of soaking under passive conditions, and followed by metal corrosion. While under active conditions, either bubbles or parylene breakdowns are observed depending on the thickness of parylene packaging. These results contribute to a better understanding of the failure mechanisms of parylene packaging in body fluids
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